EXTOLL and Chip Interfaces unveil the Industry´s first UCIe IP Solution for GlobalFoundries FDX Technology
Updated: 1 day ago
# EXTOLL and Chip Interfaces Unveil the First Integrated UCIe IP Solution for Chiplet Technology
## Revolutionizing Chiplet Connectivity
Mannheim, Germany, May 28, 2026 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, along with Chip Interfaces, a top supplier of digital IP cores, proudly introduces the industry's first integrated UCIe IP solution (PHY and D2D Adapter) for GlobalFoundries’ (GF) FDX™ technology.
This customer-ready offering is based on EXTOLL’s PHY and Chip Interfaces’ D2D Adapter. It comes as a pre-integrated and co-verified platform. This innovation unlocks unprecedented end-to-end die-to-die connectivity for mainstream technology nodes.
“Building on a highly successful collaboration with Chip Interfaces and GlobalFoundries, we are thrilled to bring our customers a powerful, timely solution that accelerates and simplifies their transition to chiplet-based systems, unleashing new levels of innovation and performance,” says Dirk Wieberneit, CEO of EXTOLL. “By combining the exceptional mixed-signal performance of GF’s FDX technology with EXTOLL’s leading-edge UCIe IP, we’re delivering real solutions for optimized chiplet-based systems that can evolve with the growing demand for faster, reliable, and more secure connectivity.”
Optimized for Standard Packaging
The IP is optimized for standard packaging. It fully supports organic substrates across standard-defined bump pitch ranges. Designed and rigorously verified for interoperability, it empowers customers to develop differentiated systems based on the UCIe v2.0 standard.
The D2D Adapter: A Game Changer
The D2D Adapter for UCIe serves as a scalable layer between protocol components and the UCIe PHY. This design enables efficient data transfer across the UCIe Link. It minimizes main data path logic for low-latency Flit transport. Additionally, it supports ARB/MUX functionality for multiple simultaneous protocols, including CXL. For Raw BER above 1e-27, it implements the UCIe-defined CRC and Retry scheme. This ensures reliable transport for PCIe, CXL, Streaming, and other protocols.
“The D2D Adapter for UCIe, combined with the UCIe PHY, forms a complete UCIe solution ready to support any protocol layer. The offering consists of two IP parts: the D2D adapter from Chip Interfaces and the UCIe PHY from EXTOLL,” says Anne Voss Winther, CEO of Chip Interfaces. “Chip Interfaces is happy to partner with EXTOLL on UCIe technology to create a complete solution for our customers.”
GF’s FDX Platform: A Foundation for Innovation
GF’s FDX platform offers superior RF/Mixed-Signal performance, power efficiency, and full System-on-Chip (SoC) integration. This delivers compact, versatile solutions for always-on, intelligent, and connected devices across a wide range of applications. The platform includes Auto Grade 1 qualification and embedded non-volatile memory (eNVM) solutions. These features provide exceptional design flexibility and rugged reliability for technologies in the automotive, communications infrastructure, and SATCOM markets. The FDX platform is manufactured at GF’s advanced facilities in New York and Germany, ensuring a geographically diverse and reliable supply chain for customers.
“We are delighted to see EXTOLL, in partnership with Chip Interfaces, deliver the industry’s first integrated UCIe solution on our FDX platform. This will unlock new capabilities for our customers designing advanced chiplets for next-generation systems spanning Physical AI, Edge AI, automotive, SATCOM, and more,” said Sudipto Bose, vice president of product management for GF’s FDX technology.
A Broad Addressable Market
The addressable market is broad, spanning Edge AI, Physical AI, robotics, aerospace and defense, as well as medical and automotive applications.
EXTOLL’s Expertise in Die-to-Die Connectivity
EXTOLL brings deep expertise in die-to-die connectivity. Its UCIe IP is a key building block for highly efficient chiplet-based architectures. This complements EXTOLL’s extensible Network-on-Chip (NoC) and SerDes IP portfolio.
About EXTOLL
EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry. We serve the worldwide market of ASIC, SoC, and Chiplet-Makers in various segments. Our portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces. EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age.
Find out more about our products and solutions – please visit us at www.extoll.com.
About Chip Interfaces
Chip Interfaces is a leading provider of silicon-agnostic, customizable digital IP cores for next-generation applications. Its portfolio includes JESD204, MIPI, Interlaken, UCIe D2D, UAlink, DiFi, CPRI/eCPRI, and High-Speed Ethernet solutions, including MAC, PCS, and MACsec.
Through advanced verification, interoperability testing with leading PHY providers, and test-bed validation, Chip Interfaces helps customers simplify integration, reduce design risk, and accelerate time to market.
Find out more about our products and solutions – please visit us at www.chipinterfaces.com.
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